Huntsman’s PU technologies for instrument panel skin, backfoaming and carriers meet the most demanding OEM specifications.
Our lightweight, semi-rigid backfoaming MDI-based PU foam provides an aesthetically pleasing, luxurious touch and feel in an instrument panel of the highest quality. Our backfoaming foam meets the toughest OEM specifications for durability, heat resistant, and low emissions.
• Excellent touch and feel
• Heat resistant
• Low emissions
• Low weight
Contact us concerning Instrument panels