I-Bond

Resins for composite wood products

 

I-BOND® resins from Huntsman are powerful, formaldehyde-free and fast curing resins for the composite wood panel industry. They are used for bonding
 
·         Oriented Strand Board (OSB)
·         Medium Density Fiberboard (MDF)
·         Particleboard (PB)
·         Wood Fiber Insulation Board (WFI)

I-BOND® resins contain no added formaldehyde (NAF) and are considered "exempt" under the requirements of the California Air Resources Board (CARB) standards. Using I-BOND® resins classifies products as both CARB I and CARB II compliant.
 
I-BOND® resins are also compliant with the European EPF-S standard, as well as the Japanese F**** (F 4 star) formaldehyde emission standard.