Wood fibre insulation board (WFI) up to a thickness of 240mm is a brand new application in the wood panel industry and another example of Huntsman's dedication to continuous innovation. This type of panel has a high performance in sound and heat insulation and offers an excellent alternative to standard insulation materials such as mineral fibre.

PB products Huntsman has developed a resin specifically for wood fibre insulation board manufacture. I-BOND® WFI 4370 is a low temperature curing MDI resin. It is designed to give excellent board properties under extreme conditions (a low press temperature or high moisture content) without negative effect on production output.

I-BOND® WFI 4370 Low temperature curing MDI resin