Enabling Ultra High-Speed Computing through Advanced Material Solutions

Data is fundamental to contemporary life, and as AI technologies progress rapidly, there is a growing need for data centers capable of supporting ultra-fast computing. Advanced Materials launched this project to develop new ultra-low-loss laminate materials for printed circuit boards used in high-speed computing and data center applications, meeting a growing market need with a scalable new product platform. These laminates, suitable for switching speeds above 224 Gigabits per second (Gbps), help maintain efficient and sustainable electrical energy transfer in these advanced systems.

To achieve such challenging performance, the Huntsman team created new hydrocarbon resin structures, expanding into previously unexplored chemistry for the division. A combination of molecular design expertise and insights from marketing and sales enabled the team to translate complex customer requirements into clear technical objectives, guiding the R&D project. Early in the process, the team determined that a liquid solution would offer optimal material performance and process compatibility, while also allowing efficient use of Huntsman’s existing manufacturing resources for scalable production.

The resulting solution, protected by multiple patents, was two ultra-low-loss products: ARALDITE® LZ 70366 and ARALDITE® LZ 80316. Collaboration with leading PCB laminate manufacturers in East Asia led to product refinement, sampling, and testing by multiple customers. Despite still being in the R&D phase, the team collected over $4 million in sampling charges from customers to help cover material costs for qualification programs. With current qualifications in place and strong customer pipeline visibility, the program is expected to generate approximately $55 million in cumulative COMA over the next five years. Huntsman is now qualified with a major manufacturer in several formulations, and our customer is qualifying its laminates with companies investing heavily in AI computing such as Google, Nvidia, and Meta, etc.

The team has also identified further applications for these products in chip coatings and advanced semiconductor packaging, which may provide additional value to Huntsman. AI tools have been deployed to help accelerate development of the next generation of products and will ensure that Huntsman maintains a leading position in the market for extremely low loss laminates. The project demonstrates effective cross-functional collaboration across marketing, sales, R&D, and manufacturing, coordinated by strong project management, and highlights how Huntsman’s advanced material solutions can address complex challenges and deliver value to customers and the company.